At the AMD Taiwan Embedded Forum this week, AMD added new processors and a new chipset to its embedded roadmap. New CPUs include the high performance AMD Turion 64 X2 Dual-Core processors TL-56 and TL-62 and an energy-efficient AMD Sempron 3700+. Also available now is an updated version of the Mobile AMD Sempron processor 2100+, which achieves up to a 15% reduction in thermal design power. All of these new products feature a consistent Socket S1, allowing for quicker development and delivery times through socket consistency and platform longevity. The latest AMD M690E chipset provides additional display design flexibility for embedded graphics and enables seamless playback of high definition video content for embedded applications.


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